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SePArate: Segmenting Patterns from Defects in Wafer Manufacturing Using Weak Supervision

arXiv · AI, language, vision and robotics · article · Aug 31, 2026 · UTC

In semiconductor manufacturing, defect analysis is essential, but manual inspection cannot scale. However, existing automated inspection methods remain insufficient for root-cause analysis and process optimization. To this end, we present SePArate, a weakly supervised wafer defect segmentation method. SePArate enables pixel-level separation of patterns by leveraging only image-level annotations. It consists of a three-phase training: encoder pretraining, knowledge transfer to learn spatial cues, and training on synthetic mixed-defect data for accurate segmentation. Experiments demonstrate that

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